? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macomtech.com for additi onal data sheets and prod uct information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 1 surmount tm pin diodes: rohs rev. v6 madp-042xx5-13060 series advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. features ?? surface mount ?? no wirebonds required ?? rugged silicon-glass construction ?? silicon nitride passivation ?? polymer scratch protection ?? low parasitic capacitance and inductance ?? high average and peak power handling ?? rohs compliant description this device is a silicon, glass pin diode surmount chip fabricated with m/a- com tech?s patented hmic tm proc- ess. this device features tw o silicon pedestals embedded in a low loss, low dispersion glass. the diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by ma king the pedestal sidewalls electrically conductive. selective backside metallization is applied producing a surface m ount device. this vertical topology provides for exceptiona l heat transfer. the topside is fully encapsulated with silicon nitride and has an additional polymer layer for scratch and impact protection. these protective coatings pr event damage to the junction and the anode air-bridge during handling and assembly. applications these packageless devices are suitable for moderate incident power applications, 10w/c.w. or where the peak power is 50w, pulse width is 1 s, and duty cycle is 0.01%. their low parasitic inductance, 0.4 nh, and excellent rc constant , make these devices a superior choice for higher frequency switch elements when compared to their plastic package counterparts. inches mm min max min max a 0.040 0.042 1.025 1.075 b 0.021 0.023 0.525 0.575 c 0.004 0.008 0.102 0.203 d 0.013 0.015 0.325 0.375 e 0.011 0.013 0.275 0.325 f 0.013 0.015 0.325 0.375 g 0.019 0.021 0.475 0.525 dim parameter absolute maximum madp-042?-13060 305 405 505 905 c.w. incident power dbm 40 44 43 35 forward current 250 ma reverse voltage -80 v operating temperature -55c to +125c storage temperature -55c to +150c junction temperature +175c mounting temperature +280c for 10 seconds absolute maximum ratings 1 @ t amb = +25c (unless otherwise specified) 1. exceeding these limits may cause permanent damage. g d e f notes: 1. backside metal: 0.1 m thick. 2. yellow hatched areas indicate backside ohmic gold contacts. 3. all devices have the same outline dimensions ( a to g).
? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macomtech.com for additi onal data sheets and prod uct information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 2 surmount tm pin diodes: rohs rev. v6 madp-042xx5-13060 series advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. specifications subject to change without notice . electrical specifications @ t amb = + 25 c parameter symbol conditions min typ max min typ max madp-042305-13060 madp-042505-13060 capacitance c t 1,3 - 10v, 1 mhz 1 pf 0.14 0.22 0.28 0.40 capacitance c t 1,3 - 10 v, 1 ghz 1,3 pf 0.15 0.28 capacitance c t 1,3 - 40 v, 1 mhz 1 pf 0.13 0.22 0.27 0.40 capacitance c t 1,3 - 40 v, 1 ghz 1,3 pf 0.14 0.27 resistance r s 2,3 + 20 ma, 1 ghz 2,3 w 1.32 0.83 forward voltage v f + 10 ma v 0.87 1.00 0.84 1.00 reverse leakage current i r -80v ua 10 10 input third order intercept point iip 3 f 1= 1000 mhz f2 = 1010 mhz input power = +20 dbm i bias = + 20 ma dbm 72 76 c.w. thermal resistance c/w 145 115 lifetime t l +10 ma / -6 ma ( 50% - 90% v ) ns 180 210 units resistance r s 2,3 + 50 ma, 1 ghz 2,3 w 1.18 0.76 parameter symbol conditions min typ max min typ max madp-042405-13060 madp-042905-13060 capacitance c t 1,3 - 10 v, 1 mhz 1 pf 0.61 0.75 0.06 0.18 capacitance c t 1,3 - 10 v, 1 ghz 1,3 pf 0.61 0.06 capacitance c t 1,3 - 40 v, 1 mhz 1 pf 0.57 0.75 0.06 0.18 capacitance c t 1,3 - 40 v, 1 ghz 1,3 pf 0.58 0.06 resistance r s 2,3 + 20 ma, 1 ghz 2,3 w 0.62 3.14 forward voltage v f + 10 ma v 0.82 1.00 0.93 1.00 reverse leakage current i r -80v ua 10 10 input third order intercept point iip 3 f 1= 1000 mhz f2 = 1010 mhz input power = +20 dbm i bias = + 20 ma dbm 80 65 c.w. thermal resistance 4 c/w 100 185 lifetime t l +10 ma / -6 ma ( 50% - 90% v ) ns 255 140 units resistance r s 2,3 + 50 ma, 1 ghz 2,3 w 0.58 2.60 1. total capacitance, c t , is equivalent to the sum of junction capacitance ,c j , and parasitic capacitance, cpar. 2. series resistance r s is equivalent to the total diode resistance : r s = r j ( junction resistance) + r c ( ohmic resistance) 3. r s and c t are measured on an hp4291a impedance analyzer with die mounted in an ods-1134 package. 4. theta ( ) is measured with the die mounted in an ods-1134 package.
? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macomtech.com for additi onal data sheets and prod uct information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 3 surmount tm pin diodes: rohs rev. v6 madp-042xx5-13060 series advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. typical performance @ t amb = +25 c rs @ 1ghz 0.100 1.000 10.000 0.001 0.010 0.100 bias (a) rs (ohm) 042905 042305 042505 042405 ct @ 1ghz 0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 0 5 10 15 20 25 30 35 40 bias (v) ct (pf) 042905 042305 042505 042405 ct vs. v rs vs. i ct @ 40v 0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.00e+ 00 2.00e+ 08 4.00e+ 08 6.00e+ 08 8.00e+ 08 1.00e+ 09 1.20e+ 09 1.40e+ 09 1.60e+ 09 1.80e+ 09 freq (hz) ct (pf) 042905 042305 042505 042405 ct @ 10v 0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.00e+ 00 2.00e+ 08 4.00e+ 08 6.00e+ 08 8.00e+ 08 1.00e+ 09 1.20e+ 09 1.40e+ 09 1.60e+ 09 1.80e+ 09 freq (hz) ct (pf) 042905 042305 042505 042405 ct vs. f ct vs. f rs @ 20ma 0.00e+00 5.00e-01 1.00e+00 1.50e+00 2.00e+00 2.50e+00 3.00e+00 3.50e+00 4.00e+00 0.00e+ 00 2.00e+ 08 4.00e+ 08 6.00e+ 08 8.00e+ 08 1.00e+ 09 1.20e+ 09 1.40e+ 09 1.60e+ 09 1.80e+ 09 freq (hz) rs (ohm) 042905 042305 042505 042405 rs @ 10ma 0.00e+00 5.00e-01 1.00e+00 1.50e+00 2.00e+00 2.50e+00 3.00e+00 3.50e+00 4.00e+00 4.50e+00 0.00e+ 00 2.00e+ 08 4.00e+ 08 6.00e+ 08 8.00e+ 08 1.00e+ 09 1.20e+ 09 1.40e+ 09 1.60e+ 09 1.80e+ 09 freq (hz) rs (ohm) 042905 042305 042505 042405 rs vs. f rs vs. f
? north america tel: 800.366.2266 / fax: 978.366.2266 ? europe tel: 44.1908.574.200 / fax: 44.1908.574.300 ? asia/pacific tel: 81.44.844.8296 / fax: 81.44.844.8298 visit www.macomtech.com for additi onal data sheets and prod uct information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. 4 surmount tm pin diodes: rohs rev. v6 madp-042xx5-13060 series advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. handling procedures all semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin oils. the use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. bulk handling should insure that abrasion and mechanical shock are minimized. bonding techniques attachment to a circuit board is made simple through the us e of surface mount technology. mounting pads are conveniently located on the bottom surface of these devic es and are removed from the active junc tion locations. these devices are well suited for solder attachment onto hard and soft s ubstrates. the use of 80au/20sn, or rohs compliant solders is recommended. for applications where the average power is ~1w, conductive silver epoxy may also be used. cure per manufacturers recommended time and temperat ure. typically 1 hour at 150c. when soldering these devices to a hard substr ate, hot gas die bonding is preferred. a vacuum tip pi ck-up tool and a force of 60 to100 grams applied to the top surface of the device is recommended. when soldering to soft substrates, su ch as duroid, it is recommended to use a soft solder at the circuit board to m ounting pad interface. position t he die so that its mounting pads are aligned with the circuit board mounting pads. while applying a downward force perpendicular to the top surface of the die, apply heat near the circuit trace and diode mounting pad. the solder connection to the two pads should not be made one at a time as this will create unequal heat flow and thermal stress to the part. solder reflow should not be performed by causing hea t to flow through the top surface of t he die to the back. since the hmic glass is transparent, the edges of the mounting pads can be visually inspected through the die after attachment is completed. typical re-flow profiles for sn60/pb40 and rohs compliant solders is provided in application note m538 , ?surface mounting instructions? and can viewed on the ma-com website @ www.macomtech.com ordering information the madp-042xx5-13060 series of surmounts may be ordered in eit her gel packs or tape and reeled by adding the appropriate suffix per the table below. tape and reel dimensions are provided in application note m513 located on the m/a-com tech?s website @ www.macomtech.com . part number gel pack tape and reel tape and reel surf tape pocket tape madp-042305-13060g madp-042305-13060t madp-042305-13060p madp-042405-13060g madp-042405-13060t madp-042405-13060p madp-042505-13060g madp-042505-13060t madp-042505-13060p madp-042905-13060g madp-042905-13060t madp-042905-13060p
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